Product type | Auto mobile |
Layers | 12L 2+8+2 |
Surface | ENIG+OSP |
Line width/spacing | 70/90μm |
Min BGA Pitch | 0.4 |
Overal board thickness | 1.2mm |
Special Characteristics | IPC-Class II |
STACK UP | COPPER FOIL 0.33OZ |
1080*1 | |
COPPER FOIL 0.33OZ | |
1080*1 | |
COPPER FOIL 0.33OZ | |
1080*1 | |
4mil H/H OZ | |
1080*1 | |
4mil H/H OZ | |
1080*1 | |
4mil H/H OZ | |
1080*1 | |
COPPER FOIL 0.33OZ | |
1080*1 | |
COPPER FOIL 0.33OZ | |
1080*1 | |
COPPER FOIL 0.33OZ |