Half via Mould board
|
Product type
|
Half via Mould board
|
|
Layers
|
4L
|
|
Surface
|
ENIG+OSP
|
|
Line width/spacing
|
74/100μm
|
|
Min BGA Pitch
|
0.4mm
|
|
Overal board thickness
|
1.2mm
|
|
Special Characteristics
|
IPC-Class II
|
|
STACK UP
|
COPPER FOIL 1/3OZ
|
|
1080
|
|
35mil 1oz/1oz
|
|
1080
|
|
COPPER FOIL 1/3OZ
|
